Author(s): Zhe Li, Zhen-Hui Qin, Shu-Mao Wu, Chen-Bei Hao, Fan-Yun Pan, Hao Yan, Yi-Han He, Yan-Chen Zhou, Xue-Jun Yan, Si-Yuan Yu, Cheng He, Ming-Hui Lu, and Yan-Feng Chen
Helical, backscattering-resistant acoustic transport in the bulk (not at edges) makes possible the fabrication of efficient, high-throughput on-chip phononic devices.
[Phys. Rev. Lett. 136, 207001] Published Fri May 22, 2026